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OX400 Low Concentration Zirconia Oxygen Analyzer

Brand: Yokogawa Electric Corporation

The OX400 is a highly accurate and reliable low-concentration zirconia oxygen analyzer that is capable of measuring a wide range of concentrations, from 0 to 10 ppm up to 0 to 100% volume Oxygen. 

This is the latest oxygen analyzer from Yokogawa, and its development was based on the company’s long experience and strong track record with this technology.

 A proprietary new thin-film deposition technology was used in the zirconia sensor that creates a molecular bond between the zirconia element and the platinum layer. 

This prevents separation, enables a reduction in sensor size and ensures a high-speed response and long life. 

The OX400 can be used to control and monitor various semiconductor applications, and to control environment, air leakage into inert gas, and other processes.
Features
  • Long life and high-speed response
    • Thanks to the use of Yokogawa’s proprietary new thin-film deposition technology, the sensor has three times the lifespan of those used in our earlier products.
    • A cylindrical sensor design facilitates the replacement of measurement gases, thereby helping to assure a high-speed response.
  • High performance and high reliability
    • Superior repeatability and linearity even at low oxygen concentrations.
    • Either pump or aspirator sampling can be selected, depending on the application.
    • CE, CSA, etc. certification.
  • Built-in functions and a variety of self-diagnosis functions
    • Comes with multi selector, auto range, partial range, and pump on/off functions.
    • A variety of self-diagnosis functions are provided that detect malfunctions such as heater temperature error, temperature sensor burnout, and sensor resistance value error.
  • Superior maintainability
    • The sensor can be replaced on-site.
    • Compact and lightweight for easy installation.

Specifications

Ambient Temperature Range

  • 0° to 40° C (32° to 104° F), Non-Condensing

Applications

  • Oxygen Concentration Control in Drying Furnaces
  • Oxygen Concentration Control in Gas Production Processes
  • Oxygen Concentration Control in Glove Boxes used in Electronics Manufacturing
  • Oxygen Concentration Control in LCD Manufacturing Processes
  • Oxygen Concentration Control in Semiconductor Related Diffusion
  • Oxygen Concentration Control in Solder Pot Flow & Re-flow Furnaces
  • Oxygen Concentration Measurements to Prevent Dust Explosions During Powder Transfer

Approvals & Certifications

  • CE
  • CSA
  • EMC EN 61326-1 Class A, EN 61326-2-3, EN 61000-3-2, EN 61000-3-3
  • IEC
  • KC
  • PSE
  • RCM EN 61326-1 Class A
  • UL

BSP Inlet

  • 1/4” BSPT Female - Gas Inlet: Line Connection

BSP Outlet

  • 1/4” BSPT Female - Gas Outlet: Line Connection

Cable Length

  • 6.56 feet (2 metres) - Power Cable
  • 8.2 feet (2.5 metres) - Power Cable

Communication

  • Baud Rate: 38,400 bit/sec
  • RS-232, One-Way

Consumption

  • 100-120 Vac, 200 VA, Max.
  • 200-240 Vac, 400 VA, Max.

Diagnostics

  • Alarm (Warning): Self-Diagnostics
  • Asymmetry Voltage Error - Alarm (Warning): Self-diagnostics
  • Calibration Error - Alarm (Warning): Self-diagnostics
  • CPU Error (Failure): Self-Diagnostics
  • Device Temperature Error - Error (Failure): Self-diagnostics
  • Electromotive Force Abnormal - Alarm (Warning): Self-diagnostics
  • Fan Stop - Error (Failure): Self-diagnostics
  • Heater Temperature Error - Error (Failure): Self-diagnostics
  • Heater Unstable - Alarm (Warning): Self-diagnostics
  • O₂ Concentration Upper/Lower - Alarm (Warning): Self-diagnostics
  • Over-Range Error - Alarm (Warning): Self-diagnostics
  • Sensor Defect - Alarm (Warning): Self-diagnostics
  • Sensor Resistance Error - Alarm (Warning): Self-diagnostics
  • Sensor Unit Error - Error (Failure): Self-diagnostics
  • Temperature Sensor Disconnection - Error (Failure): Self-diagnostics

Display

  • 4-Digit LED

Electrical Connectors

  • D-Sub 9-Pin Connector - Serial Communication
  • M3 Screws - External Output Terminals, Contact Input/Output Terminals

Electrical Rating

  • 2 A at 240 Vac (120 Vac for 100 V Power Supply) for Resistive Load - Nominal Contact Capacity
  • 2 A at 30 Vdc (120 Vac for 100 V Power Supply) for Resistive Load - Nominal Contact Capacity

Enclosure Finish

  • Polyester Coating

Flow Rate

  • 10 L/minute, Max.
  • 200 ± 25 mL/min - Sample Gas Conditions
  • Approximately 1 L/minute - Pump & Aspirator Suction Flow Rate

Humidity

  • 5 to 85 % Relative Humidity, Non-Condensing - Ambient

Linearity

  • ± 2 % of Full Scale
  • ± 3 % of Full Scale (0-100 ppm or Less)

Maximum Current

  • 2 A DC/AC

Maximum Voltage

  • 264 Vac (132 Vac for 100 V Power Supply)
  • 30 Vdc (132 Vac for 100 V Power Supply)

Measuring Range

  • 0 to 10 ppm

Media

  • Gas
  • Liquids
  • Solids

Mounting

  • Panel Mount
  • Wall Mounting

NPT Connection

  • 1/4” NPT Female - Gas Inlet, Gas Outlet: Line Connection

Output

  • 0-10 Vdc (Load Resistance: 10 kiloohms or Greater) - secondary: Analog Output
  • 4-20 mA DC, Max.

Power

  • 480 VA - Max.
  • 60 W - Max.

Power Supply

  • 100-120 Vac ± 10 %, 50/60 Hz
  • 200-240 Vac ± 10 %, 50/60 Hz

Pressure Range

  • psig: 0 to 0.043 (kPa: 0 to 0.3, Mbar: 0 to 3)

Repeatability

  • ± 1 % of Full Scale

Resolution

  • 0.01 ppm - O₂ (Oxygen)

Response Time

  • Within 10 seconds (0-1 % or more)
  • Within 30 seconds (less than 0-1 %)

Storage Temperature

  • -5° to 50° C (23° to 122° F)

Supply Pressure

  • psig: 6.42 to 14.5 (kPa: 65 to 100, bar: 0.65 to 1)

Switch Type

  • Relay

Temperature Range

  • 0° to 50° C (32° to 122° F), Non-Condensing

Thermal Drift

  • ± 2 % of Full Scale/Week

Update Time

  • Within 20 minutes - Warm-Up Time

  • Oxygen Concentration Control in Drying Furnaces
  • Oxygen Concentration Control in Gas Production Processes
  • Oxygen Concentration Control in Glove Boxes Used in Electronics Manufacturing
  • Oxygen Concentration Control in LCD Manufacturing Processes
  • Oxygen Concentration Control in Semiconductor Related Diffusion
  • Oxygen Concentration Control in Solder Pot Flow & Re-flow Furnaces
  • Oxygen Concentration Measurements to Prevent Dust Explosions During Powder Transfer
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