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CHOFORM 5528 Ag/Cu Moisture Cure One Component Form-In-Place Silicone EMI Gasketing
Brand: ChomericsParker Chomerics CHOFORM 5528 Ag filled silicone is ideal for today’s densely populated electronics packaging.
Full moisture cure in 24 hrs at 22 C with soft low closure force properties.
Features- Up to 60% reduced installation cost and nominal cost for production scale-up
- Up to 60% space savings within enclosures (gasketing available for flanges as narrow as 0.025 in)
- Excellent adhesion to common housing substrates (4-12 N/cm adhesion)
- Highly compressible gaskets, ideal for low closure force housings
- Quick turn-around of prototypes and samples
Specifications
Brand
Durometer
- 40
Filler Material
- Ag/Cu
Noise Shielding Level
- > 70 dB
Operating Features
- Soft, Low Closure-force
Package Type
- 12 fl. oz. Aluminum Cartridge
Polymer Material Options
- Silicone
Product Type
- Moisture
Shelf Life
- 6 Months
Specific Gravity
- 3.4
Specifications Met
- UL 94 V-0
Tensile Strength
- 0.86
Volume Resistivity
- 0.005 Ω-Cm