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Put Yodify's e-commerce features to work. Build out customized pricing schemes, organize your catalog by client, and create a B2B, B2C and/or Retail solution to sell to your customers, distributors and so much more all from the same site.

Automate daily tasks via Yodify's API to transform your site into a self-managed sales-driver.

Even a simple catalog without inventory or pricing creates a centralized, professional and branded hub for your sales teams and customers to reference and utilize to build quotes, hammer out details and close faster.

Save your team time, and jumpstart sales by providing a clear, concise and accurate starting point with listed MPNs or configured model numbers.

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Chomerics

Subsidiary of Parker Hannifin

Chomerics

1 - 48 of 122 Products
CHOFORM 5541 Ni/C Thermal Cure One Component Form-In-Place Silicone EMI Gasketing
CHOFORM 5541 Ni/C Thermal Cure One Component Form-In-Place Silicone EMI Gasketing
Chomerics
CHOFORM 5541 Ni/C Thermal Cure One Component Form-In-Place Silicone EMI Gasketing
THERM-A-GAP GEL 45 High Performance Fully Cured Dispensable Gels
THERM-A-GAP GEL 45 High Performance Fully Cured Dispensable Gels
Chomerics
THERM-A-GAP GEL 45 High Performance Fully Cured Dispensable Gels
SOFT-SHIELD 4850-QT Conductive Foam - Quick Turn
SOFT-SHIELD 4850-QT Conductive Foam - Quick Turn
Chomerics
SOFT-SHIELD 4850-QT Conductive Foam - Quick Turn
CHO-SHIELD 2056 Electrically Conductive Silver-Plated Copper Acrylic EMI Coating
CHO-SHIELD 2056 Electrically Conductive Silver-Plated Copper Acrylic EMI Coating
Chomerics
CHO-SHIELD 2056 Electrically Conductive Silver-Plated Copper Acrylic EMI Coating
CHO-CELL Shielded Vent Panels
CHO-CELL Shielded Vent Panels
Chomerics
CHO-CELL Shielded Vent Panels
THERM-A-FORM T646 Cure-In-Place Potting & Underfill Materials
THERM-A-FORM T646 Cure-In-Place Potting & Underfill Materials
Chomerics
THERM-A-FORM T646 Cure-In-Place Potting & Underfill Materials
SPRINGMesh Highly Resilient Metal Mesh EMI Gasketing
SPRINGMesh Highly Resilient Metal Mesh EMI Gasketing
Chomerics
SPRINGMesh Highly Resilient Metal Mesh EMI Gasketing
SOFT-SHIELD 5000 Low Closure Force, Conductive Fabric Jacket over Foam Core EMI Gaskets
SOFT-SHIELD 5000 Low Closure Force, Conductive Fabric Jacket over Foam Core EMI Gaskets
Chomerics
SOFT-SHIELD 5000 Low Closure Force, Conductive Fabric Jacket over Foam Core EMI Gaskets
MeshStrip with Elastomer Core EMI Gasketing
MeshStrip with Elastomer Core EMI Gasketing
Chomerics
MeshStrip with Elastomer Core EMI Gasketing
THERM-A-GAP 570 Thermally Conductive Gap Filler Pads
THERM-A-GAP 570 Thermally Conductive Gap Filler Pads
Chomerics
THERM-A-GAP 570 Thermally Conductive Gap Filler Pads
THERM-A-GAP 569 Thermally Conductive Gap Filler Pads
THERM-A-GAP 569 Thermally Conductive Gap Filler Pads
Chomerics
THERM-A-GAP 569 Thermally Conductive Gap Filler Pads
THERM-A-GAP™ 579 Thermally Conductive Gap Filler Pads
THERM-A-GAP™ 579 Thermally Conductive Gap Filler Pads
Chomerics
THERM-A-GAP™ 579 Thermally Conductive Gap Filler Pads
CHO-BOND 1075 One Component Corrosion Resistant Electrically Conductive Silicone Sealant
CHO-BOND 1075 One Component Corrosion Resistant Electrically Conductive Silicone Sealant
Chomerics
CHO-BOND 1075 One Component Corrosion Resistant Electrically Conductive Silicone Sealant
T670 High-Performance 3.0 w/m-K Thermal Grease for Thin Bond Lines (0.001")
T670 High-Performance 3.0 w/m-K Thermal Grease for Thin Bond Lines (0.001")
Chomerics
T670 High-Performance 3.0 w/m-K Thermal Grease for Thin Bond Lines (0.001")
CHO-BOND 1086 Silicone Adhesive Primers
CHO-BOND 1086 Silicone Adhesive Primers
Chomerics
CHO-BOND 1086 Silicone Adhesive Primers
CHO-BOND 1077 One Component Electrically Conductive Nickel Aluminum Silicone Sealant
CHO-BOND 1077 One Component Electrically Conductive Nickel Aluminum Silicone Sealant
Chomerics
CHO-BOND 1077 One Component Electrically Conductive Nickel Aluminum Silicone Sealant
THERM-A-GAP Gels T635 Dispensable, Very Low Compression Force, Thermal Gap Fillers
THERM-A-GAP Gels T635 Dispensable, Very Low Compression Force, Thermal Gap Fillers
Chomerics
THERM-A-GAP Gels T635 Dispensable, Very Low Compression Force, Thermal Gap Fillers
POLA Sponge Oriented Wire in Soft Elastomer
POLA Sponge Oriented Wire in Soft Elastomer
Chomerics
POLA Sponge Oriented Wire in Soft Elastomer
THERM-A-GAP GEL 30G High Performance Fully Cured Dispensable Gels
THERM-A-GAP GEL 30G High Performance Fully Cured Dispensable Gels
Chomerics
THERM-A-GAP GEL 30G High Performance Fully Cured Dispensable Gels
CHO-JAC Flat Cable EMI Shield
CHO-JAC Flat Cable EMI Shield
Chomerics
CHO-JAC Flat Cable EMI Shield
Metalastic EMI Gasketing with Pressure Seal
Metalastic EMI Gasketing with Pressure Seal
Chomerics
Metalastic EMI Gasketing with Pressure Seal
CHOFORM 5526 Ag Moisture Cure One Component Form-In-Place Silicone EMI Gasketing
CHOFORM 5526 Ag Moisture Cure One Component Form-In-Place Silicone EMI Gasketing
Chomerics
CHOFORM 5526 Ag Moisture Cure One Component Form-In-Place Silicone EMI Gasketing
SHIELD WRAP Knitted Wire Mesh Tape
SHIELD WRAP Knitted Wire Mesh Tape
Chomerics
SHIELD WRAP Knitted Wire Mesh Tape
TECKNIT 0005 One Component Flexible Electrically Conductive POLYOLEFIN Sealant
TECKNIT 0005 One Component Flexible Electrically Conductive POLYOLEFIN Sealant
Chomerics
TECKNIT 0005 One Component Flexible Electrically Conductive POLYOLEFIN Sealant
THERM-A-GAP 580 Thermally Conductive Gap Filler Pads
THERM-A-GAP 580 Thermally Conductive Gap Filler Pads
Chomerics
THERM-A-GAP 580 Thermally Conductive Gap Filler Pads
CHO-LUBE 4220 Electrically Conductive Grease
CHO-LUBE 4220 Electrically Conductive Grease
Chomerics
CHO-LUBE 4220 Electrically Conductive Grease
CHO-BOND 1035 One Component Electrically Conductive Silicone Sealant
CHO-BOND 1035 One Component Electrically Conductive Silicone Sealant
Chomerics
CHO-BOND 1035 One Component Electrically Conductive Silicone Sealant
CHOFORM 5513 Ag/Cu Thermal Cure Two Component Form-In-Place Silicone EMI Gasketing
CHOFORM 5513 Ag/Cu Thermal Cure Two Component Form-In-Place Silicone EMI Gasketing
Chomerics
CHOFORM 5513 Ag/Cu Thermal Cure Two Component Form-In-Place Silicone EMI Gasketing
OMNI-CELL Shielded Vent Panels
OMNI-CELL Shielded Vent Panels
Chomerics
OMNI-CELL Shielded Vent Panels
CHO-MUTE 9025 Microwave Absorber Materials
CHO-MUTE 9025 Microwave Absorber Materials
Chomerics
CHO-MUTE 9025 Microwave Absorber Materials
Porcupine Metalastic EMI Gasketing with Pressure Seal
Porcupine Metalastic EMI Gasketing with Pressure Seal
Chomerics
Porcupine Metalastic EMI Gasketing with Pressure Seal
Edge Mount Fingerstock
Edge Mount Fingerstock
Chomerics
Edge Mount Fingerstock
THERMATTACH T414 Double-Sided Thermal Tapes
THERMATTACH T414 Double-Sided Thermal Tapes
Chomerics
THERMATTACH T414 Double-Sided Thermal Tapes
COMBOStrip Metal Mesh Gasketing with Elastomer Weather Seal
COMBOStrip Metal Mesh Gasketing with Elastomer Weather Seal
Chomerics
COMBOStrip Metal Mesh Gasketing with Elastomer Weather Seal
THERM-A-GAP GEL 30 High Performance Fully Cured Dispensable Gels
THERM-A-GAP GEL 30 High Performance Fully Cured Dispensable Gels
Chomerics
THERM-A-GAP GEL 30 High Performance Fully Cured Dispensable Gels
CHO-SHIELD 571 Highly Conductive Silver Epoxy EMI Coating for Semiconductor Packages
CHO-SHIELD 571 Highly Conductive Silver Epoxy EMI Coating for Semiconductor Packages
Chomerics
CHO-SHIELD 571 Highly Conductive Silver Epoxy EMI Coating for Semiconductor Packages
SOFT-SHIELD 4850-STRIP Multi-Planar, Low-Closure Force EMI Strip Gaskets
SOFT-SHIELD 4850-STRIP Multi-Planar, Low-Closure Force EMI Strip Gaskets
Chomerics
SOFT-SHIELD 4850-STRIP Multi-Planar, Low-Closure Force EMI Strip Gaskets
CHO-SHIELD 610 Electrically Conductive Silver-Plated Copper Epoxy EMI Coating
CHO-SHIELD 610 Electrically Conductive Silver-Plated Copper Epoxy EMI Coating
Chomerics
CHO-SHIELD 610 Electrically Conductive Silver-Plated Copper Epoxy EMI Coating
Spring Line D-Connector Gaskets
Spring Line D-Connector Gaskets
Chomerics
Spring Line D-Connector Gaskets
T-WING Thin Heat Spreaders
T-WING Thin Heat Spreaders
Chomerics
T-WING Thin Heat Spreaders
THERM-A-FORM™ T644 Cure-In-Place Potting & Underfill Materials
THERM-A-FORM™ T644 Cure-In-Place Potting & Underfill Materials
Chomerics
THERM-A-FORM™ T644 Cure-In-Place Potting & Underfill Materials
No Snag Fingerstock
No Snag Fingerstock
Chomerics
No Snag Fingerstock
THERM-A-GAP Gels T630 Dispensable, Very Low Compression Force, Thermal Gap Fillers
THERM-A-GAP Gels T630 Dispensable, Very Low Compression Force, Thermal Gap Fillers
Chomerics
THERM-A-GAP Gels T630 Dispensable, Very Low Compression Force, Thermal Gap Fillers
CHO-BOND 1087 Silicone Adhesive Primer
CHO-BOND 1087 Silicone Adhesive Primer
Chomerics
CHO-BOND 1087 Silicone Adhesive Primer
CHO-SHIELD 608 Electrically Conductive Flexible Silver Polyester EMI Coating
CHO-SHIELD 608 Electrically Conductive Flexible Silver Polyester EMI Coating
Chomerics
CHO-SHIELD 608 Electrically Conductive Flexible Silver Polyester EMI Coating
CHO-SORB EMI Attenuators
CHO-SORB EMI Attenuators
Chomerics
CHO-SORB EMI Attenuators
WIN-SHIELD Micromesh High Transparency EMI Shielding Micromesh
WIN-SHIELD Micromesh High Transparency EMI Shielding Micromesh
Chomerics
WIN-SHIELD Micromesh High Transparency EMI Shielding Micromesh
SOFT-SHIELD 2000 Knitted Yarn Over Foam Core EMI Shielding Gaskets
SOFT-SHIELD 2000 Knitted Yarn Over Foam Core EMI Shielding Gaskets
Chomerics
SOFT-SHIELD 2000 Knitted Yarn Over Foam Core EMI Shielding Gaskets
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