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CHO-BOND 1029 Two Component Flexible Electrically Conductive Silicone Adhesive

Brand: Chomerics

Parker Chomerics CHO-BOND® 1029 conductive adhesive is a two-component, silver-plated copper filled silicone formulated for flexible, strong, and electrically conductive bonds. 

CHO-BOND® 1029 is a brownish red -colored silicone and is the ideal solution for bonding conductive silicone elastomer EMI gaskets to metal substrates.
Features
  • Silver-plated copper filler is a low cost solution to electrical bonding
  • Good conductivity levels (0.060 ohm-cm)
  • Moderate adhesion properties (>450 PSI lap shear strength)
  • Thick paste consistency means it can be used on overhead or vertical surfaces
  • Fast cure at elevated temperatures (30 minutes at 121°C) and room temperature cure options
  • No corrosive by-products generated when curing

Specifications

Brand

Polymer Material Options

  • Silicone

Filler Material

  • Silver-Plated Copper

Primer Included

  • 1085

Ratio

  • 1.0:2.5

Colour

  • Brownish Red

Volume Resistivity

  • 0.06 Ω-Cm

Lap Shear Strength

  • 3103 kPa

Specific Gravity

  • 3.1

Durometer

  • 80

Operating Temperature

  • -55° to 125° C

Shelf Life

  • 6 Months

Film Thickness

  • 0.2 mm
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