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CHO-SHIELD 571 Highly Conductive Silver Epoxy EMI Coating for Semiconductor Packages
Brand: ChomericsParker Chomerics CHO-SHIELD® 571 is a highly conductive, advanced coating developed for high volume, precise spray application on circuit boards and semiconductor packages.
Combined with innovative technologies and packaging designs, CHO-SHIELD® 571 can provide board level or package level EMI shielding of electrical components.
Applied correctly, CHO-SHIELD® 571 can replace stamped metal cans, saving valuable board space and reducing the overall cost of board level EMI shielding.
The polymer system has been custom formulated to closely match the coefficient of thermal expansion (CTE) of typical epoxy molding compounds resulting in great adhesion and environmental stability of the coating on semiconductor devices.
Features- Two component
- Silver in color
- Designed for high volume spray application
- Minimum 12 hour working life at room temperature
- Silver flake filler
- Excellent conductivity and EMI shielding of components
- Epoxy coating
- Good adhesion to semiconductor packaging materials due to CTE (coefficient of thermal expansion) match of polymer
- Environmentally stable
- Withstands wave solder temperatures in excess of 262°C (500°F)
Specifications
Brand
Color
- Silver
Filler Material
- Silver
Film Thickness
- 0.025 mm
Noise Shielding Level
- > 100 dB
Operating Temperature
- -40° to 125° C
Package Type
- 2 Component Kit A: 1-Pint Aluminum Can B: 4 Fluid Ounce Amber Bottle
Polymer Material Options
- Epoxy
Primer Included
- Not Required
Ratio
- 100:8.3 by Weight
Shelf Life
- 9 Months
Specific Gravity
- 1.39
Spraying Viscosity & Test Method
- 19 to 25 seconds Zahn Cup 2
Surface Resistance
- < = 0.010 Ω/square