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CHO-BOND 584-208 Two Component Electrically Conductive Epoxy Adhesive System
Brand: ChomericsParker Chomerics CHO-BOND® 584-208 conductive adhesive is a two-component epoxy formulated with an extended working life ideal for high volume applications where a strong electrical bond is required.
CHO-BOND® 584-208 is a silver-colored epoxy with a 60 minute working life meant to allow for additional application flexibility.
Features- Silver filler is a premium conductivity solution to electrical bonding
- Excellent conductivity levels (0.002 ohm-com)
- Strong adhesion properties (>1000 PSI lap shear strength)
- Medium paste makes it effective for overhead and vertical surface applications
- Can be easily dispensed from a small needle for small cracks and voids
- Fast cure at elevated temperatures (45 minutes at 100°C) and room temperature cure options
- No volatile organic compounds
- 1:1 mix ratio makes measurement and application very easy
Specifications
Brand
Polymer Material Options
- Epoxy
Filler Material
- Silver
Primer Included
- Not Required
Ratio
- 1:1 by weight
Color
- Silver
Volume Resistivity
- 0.002 Ω-Cm
Lap Shear Strength
- 6895 kPa
Specific Gravity
- 2.6
Durometer
- 80
Operating Temperature
- -62° to 100° C
Operating Time
- 1.0 hours
Shelf Life
- 9 Months
Film Thickness
- 0.03 mm