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CHO-BOND 584-208 Two Component Electrically Conductive Epoxy Adhesive System

Brand: Chomerics

Parker Chomerics CHO-BOND® 584-208 conductive adhesive is a two-component epoxy formulated with an extended working life ideal for high volume applications where a strong electrical bond is required. 

CHO-BOND® 584-208 is a silver-colored epoxy with a 60 minute working life meant to allow for additional application flexibility.
Features
  • Silver filler is a premium conductivity solution to electrical bonding
  • Excellent conductivity levels (0.002 ohm-com)
  • Strong adhesion properties (>1000 PSI lap shear strength)
  • Medium paste makes it effective for overhead and vertical surface applications
  • Can be easily dispensed from a small needle for small cracks and voids
  • Fast cure at elevated temperatures (45 minutes at 100°C) and room temperature cure options
  • No volatile organic compounds
  • 1:1 mix ratio makes measurement and application very easy

Specifications

Brand

Polymer Material Options

  • Epoxy

Filler Material

  • Silver

Primer Included

  • Not Required

Ratio

  • 1:1 by weight

Color

  • Silver

Volume Resistivity

  • 0.002 Ω-Cm

Lap Shear Strength

  • 6895 kPa

Specific Gravity

  • 2.6

Durometer

  • 80

Operating Temperature

  • -62° to 100° C

Operating Time

  • 1.0 hours

Shelf Life

  • 9 Months

Film Thickness

  • 0.03 mm
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