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CHOFORM 5541 Ni/C Thermal Cure One Component Form-In-Place Silicone EMI Gasketing
Brand: ChomericsParker Chomerics CHOFORM 5541 Ni/C filled silicone is ideal for today’s densely populated electronics packaging.
Full Thermal cure in 30 mins at 150 C with corrosion resistant high temp properties.
Features- Up to 60% reduced installation cost and nominal cost for production scale-up
- Up to 60% space savings within enclosures (gasketing available for flanges as narrow as 0.025 in)
- Excellent adhesion to common housing substrates (4-12 N/cm adhesion)
- Highly compressible gaskets, ideal for low closure force housings
- Quick turn-around of prototypes and samples
Specifications
Brand
Durometer
- 75
Filler Material
- Ni/C
Meets Certifications
- UL 94 V-0
Noise Shielding Level
- > 65 dB
Operating Features
- Corrosion Resistant, High Temp
Package Type
- 12 fl. oz. Aluminum Cartridge
Polymer Material Options
- Silicone
Product Type
- Thermal
Shelf Life
- 6 Months
Specific Gravity
- 2.4
Tensile Strength
- 3.5
Volume Resistivity
- 0.03 Ω-Cm