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THERM-A-FORM T646 Cure-In-Place Potting & Underfill Materials
Brand: ChomericsParker Chomerics THERM-A-FORM™ T646 is a two-component, high pot life (5 hours), economical silicone elastomer with 0.9 W/m-k thermal conductivity.
THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications.
These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet.
Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.
Features- Dispensable form-in-place gap filling, potting, sealing, and encapsulating
- Excellent blend of high thermal conductivity, flexibility, and ease of use
- Conformable to irregular shapes without excessive force on components
- Ready-to-use cartridge system eliminates weighing, mixing, and de-gassing steps
- Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes, and pneumatic applicators)
- Vibration damping
Specifications
Brand
Coefficient of Thermal Expansion
- 250 ppm/K
Color
- Yellow
Dielectric Constant
- 6.5 @ 1 MHz
Dielectric Strength
- 250 Vac/mil
Dissipation Factor
- 0.013 @ 1 MHz
Durometer
- 50
Dynamic Viscosity
- > 5000 P
Filler Material
- Aluminum Oxide
Heat Capacity
- 1 J/g-K
Outgassing Total Mass Loss
- 0.17 (0.10) %
Package Type
- 1:1 Dual Element Cartridge
Polymer Material Options
- Silicone
Ratio
- 01:01
Shelf Life
- 3 Months
Specific Gravity
- 2.45
Specifications Met
- UL 94 V-0, RoHS
Temperature Range
- -58° to 302° F
Thermal Conductivity
- 0.9 watt/m-K
Volume Resistivity
- 10^14 Ω-Cm