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Instantly add the THERM-A-FORM™ T644 Cure-In-Place Potting & Underfill Materials and 50,000+ more product series to your store or catalog  
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THERM-A-FORM™ T644 Cure-in-Place Potting and Underfill Materials

THERM-A-FORM™ T644 Cure-In-Place Potting & Underfill Materials

Brand: Chomerics
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Parker Chomerics THERM-A-FORM™ T644 is a two-component, high thermal conductivity (1.2 W/m-k), low modulus, silicone material ideal for transferring heat from fragile electronic components.

THERM-A-FORM™ thermally conductive silicone elastomer products are dispensable form-in-place compounds designed for heat transfer without excessive compressive force in electronics cooling applications. 

These versatile liquid reactive materials can be dispensed and then cured into complex geometries for cooling of multi-height components on a PCB without the expense of a molded sheet. 

Each compound is available in ready-to-use cartridge systems, eliminating weighing, mixing, and degassing procedures.
Features
  • Dispensable form-in-place gap filling, potting, sealing, and encapsulating
  • Excellent blend of high thermal conductivity, flexibility, and ease of use
  • Conformable to irregular shapes without excessive force on components
  • Ready-to-use cartridge system eliminates weighing, mixing, and de-gassing steps
  • Variety of kit sizes and configurations available to suit any application (handheld twin-barrel cartridges, Semco® tubes, and pneumatic applicators)
  • Vibration damping

Specifications

Brand

Coefficient of Thermal Expansion

  • 300 ppm/k

Color

  • Pink

Dielectric Constant

  • 4 @ 1 MHz

Dielectric Strength

  • 500 Vac/mil

Dissipation Factor

  • 0.001 @ 1 MHz

Durometer

  • 15

Dynamic Viscosity

  • 3000 P

Filler Material

  • Boron Nitride

Heat Capacity

  • 1 J/g-K

Outgassing Total Mass Loss

  • 0.39 (0.29) %

Package Type

  • 1:1 Dual Element Cartridge

Polymer Material Options

  • Silicone

Ratio

  • 01:01

Shelf Life

  • 3 Months

Specific Gravity

  • 1.45

Specifications Met

  • UL 94 V-0, RoHS

Temperature Range

  • -58° to 302° F

Thermal Conductivity

  • 1.2 watt/m-K

Volume Resistivity

  • 10^13 Ω-Cm

Documentation

Data Sheets

Brochure

Certifications

Glossary of Terms & Definitions

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